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Micro Sieves

《Product Introduce 》:

Application: Mesh for particle seperation, like solder ball, diamond powder, metal powder, etc.


Material:Ni, Ni alloy
Hole Diameter:Min. 20 μm


* High accuracy with tight tolerances

* Smooth sieving side for easy cleaning

* Smooth hole to avoid scratching

* Liga provides customized service based on customer's requirements.