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Micro Sieves

《 Introduction》：

【Application】

  Mesh for particle seperation, like solder ball, diamond powder, metal powder, etc.


【Features】

  * High accuracy with tight tolerances

  * Smooth sieving side for easy cleaning

  * Smooth hole to avoid scratching


【General Spec】

  Material: Ni, Ni alloy
  Hole Diameter: Min. 20 μm

  Thickness: 20-80μm

* Liga provides customized service based on customer's requirements.